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PH60 Rev.3

PH60 Rev.3 is a 60% tri-mode mechanical keyboard kit with an FDM 3D-printable case and the PH60 Rev.3 Multi PCB. This revision switches to the NRF52840 MCU with Bluetooth 5.3 and Nordic 2.4 GHz proprietary protocol (TBD), runs ZMKs firmware (our fork of ZMK), and redesigns the case for wireless use and multi-layout compatibility.

PH60 Rev.3 Bloom

PH60 Rev.3 Front

PH60 Rev.3 Back

PH60 Rev.3 PCB

Features

PCB

  • Nordic NRF52840 MCU, Bluetooth 5.3 + 2.4 GHz (TBD).
  • ZMKs firmware with ZMKs Studio for real-time keymap editing.
  • Multi-layout support — ANSI / ISO / WK / WKL / HHKB, plus split spacebar: 6.25u → 2.75u + 1u + 2.5u, 7u → 3u + 1u + 3u.
  • Battery powered, built-in battery connector.

Note on ANSI/ISO variants: Rev.3 currently only ships the Multi layout PCB. The ANSI PCB in this repo is an early prototype with a fundamentally different design approach — there is no standalone ISO version. We may develop dedicated ANSI/ISO variants based on ZMKs in the future.

Case

  • Designed for FDM 3D printing — printable on any printer with a bed ≥ 256 × 256 mm, no supports required.
  • Magnetic quick-release latches — tool-free disassembly.
  • O-ring gasket plate mount — firm, crisp feel without foam.
  • Modular battery tray and magnet drawers, fits up to 100 × 50 × 5 mm LiPo and 10 × 5 × 5 mm magnets.
  • Locking holder for wireless receivers, compatible with most commercial 2.4 GHz receiver housings.
  • Multiple outer case variants: Standard, WKL, HHKB (6u/7u), and split backspace options.

Plates

  • Plates available for ANSI, ISO, WK, HHKB (6u/7u), LS64, EC60, and split-key variants.
  • More layouts added over time.

What's new compared to Rev.2

Rev.2 Rev.3
MCU RP2040 NRF52840
Connectivity USB only USB + Bluetooth 5.3 + 2.4 GHz (TBD)
Firmware QMK + VIA ZMKs + ZMKs Studio
Power USB powered Battery powered
Split spacebar Not supported 6.25u & 7u split
Case 3-piece modular Magnetic quick-release, O-ring gasket

Customizer

Configure your PH60 Rev.3 with live 3D preview at custom.phdesign.cc.

PHD Customizer


Project Structure

PH60 Rev.3
├── Assets/                         # Preview images
├── Case_Model_Rev3/                # Case 3D model files (STEP)
├── LICENSE
├── PCB_Model_Rev3/                 # PCB 3D model files
├── PCB_Rev3/
│   ├── ANSI/                       # ANSI variant (early prototype)
│   └── Multi/                      # Multi-layout variant (primary)
├── Plates_Rev3/                    # Plate files (STEP)
├── Production/
│   ├── PH60-Rev3-ANSI/             # ANSI production files
│   └── PH60-Rev3-Multi/            # Multi production files
├── README.md
└── README-zh_CN.md

Printing Guide

The case prints well with default FDM settings. Recommended parameters for best results:

Setting Recommended Notes
Filament PLA or PETG High-temp materials increase warp risk
Layer height 0.2 mm Model designed around 0.2 mm
Wall count 2 walls
Infill pattern Gyroid
Infill density 15%
Wall generator Arachne Improves print speed
Accurate outer wall Enabled Reduces visible layer lines
Support Off Designed for supportless printing

Make sure the bed is leveled and clean before printing. Use adhesive on long parts like the top cover to prevent warping. Sand and clean prints for a better finish.

Assembly

Bill of Materials

Item Qty Notes
3D printed case parts 1 set PLA or PETG recommended
PH60 Rev.3 Multi PCB 1 Pre-soldered SMD components
MX-compatible switches 61+ Varies by layout
Keycaps 1 set Compatible with 60% layout
LiPo battery (optional) 1 Recommended: 100 × 50 × 5 mm, Molex 1.25 mm connector
Magnets 8 Recommended: 10 × 5 × 3 mm, N52
Silicone O-rings 8 OD 9 mm, cord 1.5 mm
Silicone anti-slip pads 4 Recommended: 20 × 10 × 2 mm

For detailed assembly steps, refer to the Wiki.

Firmware

Getting Firmware

Flashing Firmware

  1. Enter bootloader: Press FN + B + R, or remove the spacebar keycap and double-tap the BOOT pads with tweezers.
  2. Flash: The keyboard appears as a USB storage device. Copy the .uf2 file to it — the keyboard reboots automatically.

Keymap Customization

Visit ZMKs Studio for real-time keymap editing.

FAQ

Q: Which 3D printers can print the Rev.3 case? A: Any FDM printer with a bed ≥ 256 × 256 mm that can print PLA or PETG.

Q: Which layouts does the Rev.3 case support? A: ANSI, ISO, HHKB, WK, WKL, LS64, and EC60 (NIZ electrostatic capacitive). Plate designs are continuously updated.

Q: Why is there no dedicated ANSI or ISO PCB? A: The early ANSI prototype has a fundamentally different design from the Multi PCB. We focused on Multi to support all layouts with a single board. Dedicated variants may come later based on ZMKs.

Q: What battery and magnet sizes are supported? A: Up to 100 × 50 × 5 mm LiPo battery. Magnets: 10 × 5 × 3 mm (N52 recommended). The battery tray and magnet drawers can be modified for other sizes.

Getting Help