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ML01 PROJECT – SPECIFICATIONS

The ML01 project is an electronic system based on a Raspberry Pi Pico 2W.
Its main role is to control 16 yellow LEDs using 2 buttons and a lightweight embedded web interface using the Microdot framework.
All components are Through-Hole Technology (THT) and require assembly onto a printed circuit board (DIY).

⚠️ LIMITATIONS AND WARNINGS ⚠️

  • Indoor use only
  • Not CE/FCC certified | Hobbyist/educational use only
  • DIY assembly required | Soldering skills necessary
  • Open PCB design | Avoid contact with conductive materials
  • ESD sensitive | Handle with antistatic precautions
  • No over-voltage protection beyond PTC fuse
  • Wi-Fi stability depends on local environment and interference
  • Safety Precautions while the device is powered: thank you for reading the details at the end of this document.

The following guides are provided in separate documentation files:


A. FUNCTIONS

A1. LED modes by default

  • FULL mode: all 16 LEDs ON continuously
  • CHASE mode: dynamic LED animation sequence synchromnized with Time NTP server
  • OFF mode: all LEDs OFF
  • OTHER modes: also you could completely reprogram the microcontroller according to your needs.

A2. User Button Actions

Button 1:

  • Short press: cycle through modes → FULL → CHASE → OFF
  • Long press: stop script execution

Button 2:

  • Long press: system reboot

A3. Web Interface (Microdot):

  • Lightweight HTTP server running on Raspberry Pi Pico 2W
  • Default port: 5000
  • Provides remote access to LED modes, system status, and log viewing-exporting
  • Requires Wi-Fi connection (SSID/password configured in firmware)

B. HARDWARE

B1. Main Controller: 1× Raspberry Pi Pico 2W RP2350 (THT variant)

  • Handles GPIO control, timing, LED driving logic, and web server
  • Powered via VSYS (pin 39) from external PSU or USB

B2. Output Driving: 2× TPIC6B595N power shift registers

  • 8 open-drain DMOS outputs per chip
  • Up to 150 mA continuous current per output
  • Daisy-chain capable (SER OUT → SER IN)
  • VCC: +5V, logic-compatible with 3.3V GPIO

B3. Optoelectronics: 16× yellow LEDs

  • High efficiency
  • Low power consumption
  • Dimension: 5mm round standard
  • Brightness: 2500 mcd typical
  • Viewing angle: 60°
  • Forward voltage: 1.9 to 2.3V typical
  • Maximum forward current: 30 mA

B4. User Input: 2× push buttons (6×6 mm, 1.6 N travel)

  • Button 1: GPIO 4
  • Button 2: GPIO 5
  • Internal pull-ups enabled in firmware

B5. Power Conditioning

16× 160 Ω metal-film resistors (1% 0.6 W): current limiting for LEDs (~18 mA per LED)

7× 100 nF ceramic capacitors (X7R, 10% tolerance):

  • 1× per TPIC6B595N
  • 4× near LED clusters
  • 1× parallel to main electrolytic capacitor

1× 100 µF electrolytic capacitor (Ø6.30 mm, H11.20 mm): main power input filtering (+5V to GND)

1× resettable PTC fuse (Bourns MF-R050):

  • Hold current: 0.5 A
  • Trip current: 1.0 A
  • Max voltage: 30 V
  • Power rating: 750 mW
  • Resistance: 770 mΩ

B6. Power Input

PARAMETER VALUE
Voltage 5 V DC
Current (FULL mode) ~260 mA (1.3 W)
Current (OFF mode) ~35 mA (0.18 W)
Protection PTC resettable fuse (0.5 A hold / 1 A trip)

B7. Power Supply: 1x Raspberry Pi 12.7W Micro USB

  • AC 100-240V 50/60Hz input
  • DC 5.1V 2.5A output
  • 12.7W maximum output power
  • 1.5m 18AWG captive cable
  • Micro USB output connector
  • Can alternatively be powered via USB port from computer.

B8. LED Driving

  • Open-drain low-side switching via TPIC6B595
  • LED anodes connected to +5 V
  • LED cathodes connected to TPIC DRAIN outputs through 160 Ω resistors
  • LED current per channel: ~18 mA @ 5V supply
  • Calculation: (5V - 2.1V Vf) / 160Ω ≈ 18 mA

B9. Decoupling Strategy

  • 1x 100 nF ceramic capacitor on each TPIC6B595N (VCC to GND)
  • 4× 100 nF ceramic capacitors distributed near LED clusters
  • 1× 100 nF ceramic capacitor in parallel with electrolytic capacitor at main power input
  • 1x 100 µF electrolytic capacitor in parallel with ceramic capacitor at main power input

B10. PCB Specifications

PROPERTY VALUE
Dimensions 165 × 110 mm
Thickness 1.6 mm
Layer Count 2
Copper Weight 1 oz (35 µm)
Surface Finish HASL lead-free
Solder Mask Color Green
Component Mounting Through-Hole (THT)

C. WIRING

C1. GPIO Pin Mapping for Raspberry Pi Pico 2W

GPIO PIN FUNCTION CONNECTION
GPIO 4 Button 1 Input Push button (active LOW)
GPIO 5 Button 2 Input Push button (active LOW)
GPIO 7 TPIC SER IN Serial data to first TPIC
GPIO 8 TPIC RCK Register clock (both)
GPIO 9 TPIC SRCK Shift register clock (both)

C2. TPIC6B595N Pin Mapping

First TPIC (chain input):

PIN CONNECTION
Pin 1, 20 Not used
Pin 2 (VCC) +5V (Pico pin 39, VSYS)
Pin 3 (SER IN) Pico GPIO 7
Pins 4-7(DRAIN 0-3) LED cathodes via 160Ω resistors
Pin 8 (SRCLR) +5V (reset disabled, always HIGH)
Pin 9 (G) GND (outputs always enabled, active LOW)
Pin 10, 11, 19 (GND) Pico GND (pin 3)
Pin 12 (RCK) Pico GPIO 8
Pin 13 (SRCK) Pico GPIO 9
Pins 14-17 (DRAIN 4-7) LED cathodes via 160Ω resistors
Pin 18 (SER OUT) Pin 3 (SER IN) of second TPIC

Second TPIC (chain output):
Same connections as first TPIC apart from the differences below:

  • Pin 3 (SER IN) ← Pin 18 (SER OUT) of first TPIC
  • Pin 18 (SER OUT) → not connected

C3. LEDs Connections

  • LED anodes → +5 V (common rail)
  • LED cathodes → TPIC DRAIN outputs via 160 Ω resistor

C4. Buttons Connections

  • Button 1 → One pin to GPIO 4 (Pico pin 6), other pin to GND
  • Button 2 → One pin to GPIO 5 (Pico pin 7), other pin to GND
  • Internal pull-up resistors enabled in firmware (buttons active LOW)

D. SOFTWARE

D1. Firmware (MicroPython for Raspberry Pi Pico 2W RP2350)

  • Download last version UF2 bootloader image here
  • Flash via USB mass storage mode

D2. Program Structure

  • main.py: main control program, download last version here
  • index.html: web interface for remote control and log viewing/exporting, download last version here
  • microdot.py : lightweight web server, download last version here

D3. Dependencies and References


E. ENCLOSURE CONSIDERATIONS (to be printed according to provided 3D files)

This is an open PCB design:

  • The PCB stand allows 2 possible tilt angles: 80° and 60°.
  • The PCB stand must be printed according to the file provided on this repo here or Printables here
  • The ML01 project deliberately does not include a fully enclosed protective case at this stage.
  • This design choice allows all electronic components to remain visible, which is valuable for:
    - Educational purposes and learning electronics
    - Demonstrating the circuit layout and component placement
    - Aesthetic appreciation of the assembled board

⚠️ Safety Precautions while the device is powered:

  • Do NOT touch any part of the PCB except the two push buttons
  • Risk of electric shock from exposed 5V circuitry
  • Risk of short circuits causing component damage or failure
  • Risk of ESD damage to sensitive components (Pico 2W, TPICs)

This device is fragile:

  • Solder joints and component leads can break with rough handling
  • Through-hole components are more robust than SMD but still require care
  • Use the provided 3D-printed stand to minimize handling

Indoor use only:

  • Indoor use in dry, controlled environments (typical household/office: 30–60% RH)
  • Not rated for outdoor or humid environments (no conformal coating)
  • Keep away from water, liquids, and excessive moisture
  • Avoid dusty or dirty environments that could cause short circuits

Recommended operating environment:

  • Recommended ambient: 15–30°C for optimal long-term reliability (mini 0°C to max 70°C)
  • Keep away from direct sunlight to prevent overheating
  • Workbench or desk in a clean (avoid directly on the ground)
  • Display area with controlled access (away from children and pets)

Future Enclosure Options:

  • A protective enclosure may be offered in future revisions of this project if the need is actually confirmed.
  • Users who require additional protection may design their own enclosure, ensuring adequate ventilation for heat dissipation.

F. COMPLIANCE AND STANDARDS

This device is intended for personal, non-commercial use only.
Users are responsible for ensuring compliance with local regulations if used in any commercial capacity.

It has not been tested or certified to meet:

  • CE electromagnetic compatibility standards
  • FCC Part 15 regulations
  • RoHS compliance (components should be RoHS-compliant when sourced)

Revision date: 2026.01.26
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